do not scale from this print yfs-xx-x3-x-xx-xsb-xx no of positions -20, -30, -40, -50 (per row) row specification -05: five (use yfsp-xx-01-f) -08: eight (use yfsp-xx-01-e) -10: ten (use yfsp-xx-01-t) -06: six (use yfsp-xx-01-6) (available in 20 pos. only) -03: three (use yfsp-xx-01-3) (available in 20 pos. only) plating specification -g: gold (use c-xxx-03-g) (see note 7) -h: heavy gold (use c-xxx-03-h) -e: extra gold (use c-xxx-03-e) (see note 7) option -k: kapton pad (see fig. 2, sht. 2) -tr: tape & reel lead style -03: pin / solderballs (use c-140-03-x, see fig. 1) -l3: pin / solderballs (low insertion force) (use c-226-03-x) solder balls -sb: solder ball (use sdb-030-6337) -msb: modified solder ball (use sdb-030-9653, pb free,see note 14) * = not engineering approved * h .145 3.68 ref (no of pos x .0500[1.270]) + .120[3.05] ref "b" ref (no of pos x .0500[1.270]) + .020[.51] ref "a" eq spaces @ .0500[1.270] ((no of pos -1) x .0500[1.270])) .0020[.051] .035 ref 0.89 "a" "a" "b" "b" c1 01 yfsp-xx-01-x 02 09 (pin # = no. of rows +1) .095 2.41 ref .104 2.64 ref .012 0.31 (see note 9) .134 .003 3.41 0.08 section "a"-"a" c-xxx-03-x sdb-030-xxxx 'a' section "b"-"b" see note 6 detail 'a' scale 5 : 1 in-process without solderballs c h sheet of unless otherwise specified, dimensions are in inches. tolerances are: decimals angles .xx: .01[.3] 2 .xxx: .005[.13] .xxxx: .0020[.051] material: .050[1.27] multi-row socket asm. by: yfs-xx-x3-x-xx-xsb-xx dwg. no. description: proprietary note this document contains information confidential and proprietary to samtec, inc. and shall not be reproduced or transferred to other documents or disclosed to others or used for any purpose other than that which it was obtained without the expressed written consent of samtec, inc. do not scale drawing kevin b 4/22/99 2 1 sheet scale: 2.5:1 insulator: lcp, color: black contact: phos bronze f:\dwg\misc\mktg\yfs-xx-x3-x-xx-xsb-xx-mkt.slddrw notes: 1. represents a critical dimension. 2. note deleted. 3. burr allowance: .0005[0.013] max. 4. minimum pushout force: .5 lb. 5. note deleted. 6. contact to be flush .002[0.05] recessed. 7. one reel minimum plating requirement (85,000 contacts per reel) 8. all dims to be symmetrical about the centerline within .001[0.03]. 9. .0025[0.064] max variation between solderballs. 10. refer to visual inspection board for solderball appearance checks. 11. the distance from the center of any solderball to the center of any adjacent inner peg shall be .025 .005[0.64 0.13]. 12. solder joints to be inspected per ipc specification 12.2.12 (ipc-a-610c). 13. note deleted 14. contact samtec ces department for processing information. 520 park east blvd, new albany, in 47150 phone: 812-944-6733 fax: 812-948-5047 e-mail info@samtec.com code 55322 revision h
.139 3.541 "r" "s" "c" "d" .010[0.25] fig. 2 -k: kapton pad option packaging views h -03 -05 -06 -08 -10 r = (no of pos x .0500[1.270]) + .020[.51] s = ("r" - "c" / 2) .020[.51] sheet of .050[1.27] multi-row socket asm. by: yfs-xx-x3-x-xx-xsb-xx dwg. no. description: proprietary note this document contains information confidential and proprietary to samtec, inc. and shall not be reproduced or transferred to other documents or disclosed to others or used for any purpose other than that which it was obtained without the expressed written consent of samtec, inc. do not scale drawing kevin b 4/22/99 2 2 sheet scale: 2.5:1 revision h f:\dwg\misc\mktg\yfs-xx-x3-x-xx-xsb-xx-mkt.slddrw 520 park east blvd, new albany, in 47150 phone: 812-944-6733 fax: 812-948-5047 e-mail info@samtec.com code 55322
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